根据GEIA-STD-0005-1《含无铅焊料的航空航天和高性能电子系统性能标准》，本手册旨在帮助项目确保产品的性能、可靠性、适航性、安全性和可认证性。请注意，项目经理、系统工程、供应链和质量保证经理（以及他们各自的组织）和适当的企业主管部门需要共同努力，确保理解无铅技术插入的所有影响，并相应降低风险。在本文中，项目管理（或经理）、供应链管理（或经理）、质量保证管理（或经理）和系统工程管理（或经理）和/或适当的企业管理机构应在剩余文件中定义为“责任经理”（见第3节，术语和定义）。 本手册中描述的基本原则可用于任何航空航天和/或高性能项目的项目管理、系统工程、供应链管理和质量保证管理。附录A包含处理无铅问题的总负责经理清单。检查表可用于确定与本手册第5节至第15节内容相关的潜在问题。无铅技术可以影响任何项目，无论该项目本身是否受到环境法规的豁免或约束。向无铅焊料技术的行业转换可能会通过以下三种方式之一或组合影响ADHP电子产品的制造商和消费者: （1） 如果项目需要实施无铅技术（合同要求、环境法规等），则负责项目执行的组织经理需要评估内部过渡对设计（例如，使用无铅产品的性能）和工艺（例如，制造无铅产品的工艺）的影响。（2） 如果该项目为其产品/系统购买COTS（商用现货）项目，那么这些项目很有可能在零件、PWB或PBA上包含无铅焊料或无铅饰面。（3） ADHP电子产品制造商可能无意中引入Pb- 如果买方和供应商之间未进行仔细协调，则免费提供零件或组件（包括组件表面处理、印制电路板（PWB）表面处理或组装焊料）。

This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, “Performance Standard for Aerospace and High Performance Electronic Systems Containing Pb-free Solder”. Please note that the program manager, and managers of systems engineering, Supply Chain and Quality Assurance (along with their respective organizations), and the appropriate enterprise authority need to work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein “program management (or manager), supplier chain management (or manager), quality assurance management (or manager) and systems engineering management (or manager) and/or the appropriate enterprise authority” shall be defined as “responsible manager” throughout the remaining document (see Section 3, Terms and Definitions).The basic principles delineated in this handbook can be used for program management, system engineering, supply chain management and quality assurance management of any aerospace and/or high performance program. Appendix A contains a General Responsible Manager Checklist for Dealing with Pb-free Issues. The checklist can be used to identify potential issues related to the content in sections 5 through 15 of this handbook.Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations. The industry conversion to Pb-free solder technology may affect manufacturers and consumers of ADHP electronics in one or combinations of the following three ways: (1) If the program is required to implement Pb-free technology (contract requirement, environmental regulation, etc), then the managers of organizations responsible for program execution will need to assess the impact of in-house transition with respect to design (e.g., performance of products using Pb-free) and process (e.g., processes to build Pb-free products). (2) If the program purchases COTS (Commercial-off-the-Shelf) items for its products/systems, then there is a very good chance that these items will contain Pb-free solder or Pb-free finishes on parts, PWBs, or PBAs. (3) Manufacturers of ADHP electronics may inadvertently introduce Pb-free parts or assemblies (including component finish, Printed Wiring Board (PWB) finish, or assembly solder) if careful coordination between buyer and supplier is not exercised.