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Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards 刚性和多层印制板用嵌入式无源器件电阻器材料规范
发布日期: 2008-05-01
本文件描述了可用于在成品印刷电路板基板内制造嵌入式无源电阻器装置的材料。它提供了嵌入式无源器件(EPD)电阻器材料的一般名称和相关特性的信息。当设计或建造包含这些EPD材料的印刷电路板时,本文件应作为设计师和用户的资格和一致性标准。本文件包含材料名称、一致性(要求)、鉴定(特性)和质量保证规范。本文件应与IPC-2200系列设计和IPC-6010系列鉴定和性能标准结合使用。26页。2008年4月发布。
This document describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate. It provides information on general designations and associated characteristics of embedded passive device (EPD) resistor materials. The document shall be used as a qualification and conformance standard for designers and users when designing or constructing printed circuit boards containing these EPD materials. This document contains material designation, conformance (requirements), qualification (characterization) and quality assurance specifications. This document should be used in conjunction with both the IPC-2200 series design and the IPC-6010 series qualification and performance standards. 26 pages. Released April 2008.
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