Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints
电子组装技术

2012-03-31

전자부품 조립기술－납땜접합에 대한 환경 및 내구성 시험방법 선택 안내
电子组装技术焊点环境和耐久性试验方法选择指南

2012-11-19

전자부품 조립기술－납땜접합에 대한 환경 및 내구성 시험방법 선택 안내
电子组装技术－焊点环境和耐久性试验方法的选择指南

2012-11-19

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
电子组装技术 - 第3部分:焊接环境和耐久性测试方法的选择指导

2011-11-08

Технология сборки изделий электроники. Часть 3. Руководство по выбору методов экологических и ресурсных испытаний для паяных соединений
电子组装技术 第3部分焊点环境和耐久试验方法的选择指导

BS EN 62137-3. Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
英国标准EN 62137-3 电子组装技术 焊点环境和耐久性试验方法的选择指南

2009-06-30

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
电子组装技术.第3部分:焊点环境和耐久性试验方法的选择指南（IEC 62137-3-2011）；德文版EN 62137-3:2012

2012-08-01

Draft Document - Process management for avionics - Aerospace and defence electronic systems containing lead free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies (IEC 107/206/DTS:2013)
文件草稿.航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第23部分:解决无铅电子设备和混合组件影响的返工和修理指南（IEC 107/206/DTS:2013）

2013-08-01

Draft Document - Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English
文件草案-设备嵌入组装技术-第2-602部分:堆叠电子模块指南-模块间电气连接的评估方法（IEC 91/1629/CD:2019）；德语和英语文本

2020-11-01