Amendment 1 - Printed electronics - Part 201: Materials - Substrates
修改件1.印刷电子产品.第201部分:材料.基板

2018-11-15

Draft Document - Printed electronics - Materials - Part 2-1: Conductive Material Ink (IEC 119/49A/CD:2014)
文件草稿印刷电子材料第2-1部分:导电材料油墨（IEC 119/49A/CD:2014）

2014-11-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)
文件草稿.印制板和其他互连结构用材料.第3-1部分:挠性板用覆铜层压板（粘合剂和非粘合剂类型）（IEC 91/752/CD:2008）

2008-05-01

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs (IEC 91/1186/CD:2014)
文件草稿-电气材料、印制板和其他互连结构和组件的试验方法-第3-913部分:高亮度LED用电子电路板导热性的试验方法（IEC 91/1186/CD:2014）

2014-09-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/677/CDV:2007); German version prEN 61249-2-34:2007
文件草稿.文件草稿.印制板和其他互连结构用材料.第2-34部分:高频应用的包覆和非包覆增强基材.非卤化改性或未改性树脂系统.规定相对许可度的E玻璃编织层压板

2007-07-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/675/CDV:2007); German version prEN 61249-2-33:2007
文件草案.文件草案.印制板和其他互连结构用材料.第2-33部分:高频应用的包覆和非包覆增强基材.非卤化改性或未改性树脂系统.规定相对许可度的E玻璃编织层压板

2007-07-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/671/CDV:2007); German version prEN 61249-2-31:2007
文件草案.文件草案.印制板和其他互连结构用材料.第2-31部分:高频应用的包覆和非包覆增强基材.卤化改性或未改性树脂系统.规定相对介电常数的编织E玻璃层压板

2007-07-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/673/CDV:2007); German version prEN 61249-2-32:2007
文件草稿.文件草稿.印制板和其他互连结构用材料.第2-32部分:高频应用的包覆和非包覆增强基材.卤化改性或未改性树脂系统.规定相对介电常数的编织E玻璃层压板

2007-07-01