单面(4向上)图案,用于评估印刷电路板上焊剂和焊膏残留物的相互作用。该电路板包含4个带有。4毫米线条和5毫米空间。(2片30 x 45厘米1:1)胶卷。
Single-sided (4 up) pattern used for evaluating interaction of solder flux & solder paste residues on printed boards. The board contains 4 comb patterns with.4 mm lines &.5 mm spaces. (2 pcs 30 x 45 cm 1:1) Film.