BS 4584-15:1978-印制线路板用金属覆层基材涂胶聚合物薄膜:PETP-F-15和PI-F-15-国家数字标准馆

现行 BS 4584-15:1978

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Metal-clad base materials for printed wiring boards-Adhesive coated polymeric films: PETP-F-15 and PI-F-15 印制线路板用金属覆层基材涂胶聚合物薄膜:PETP-F-15和PI-F-15

发布日期： 1978-10-31

柔性印刷电路板用聚酯和聚酰亚胺薄膜的性能。交叉引用:BS 219*BS 2011:第1.1部分*BS 2011:第2.1B部分*BS 2011:第2.1Ca部分*BS 3502*BS 4584:第1部分*BS 4584:第9部分*BS 4584:第10部分*ISO/R 1326*IEC 249-2*IEC 249-3*IEC 250*

Properties of films of polyester and polyimide used as cover sheets for flexible printed circuits.Cross References:BS 219*BS 2011:Part 1.1*BS 2011:Part 2.1B *BS 2011:Part 2.1Ca*BS 3502*BS 4584:Part 1 *BS 4584:Part 9*BS 4584:Part 10*ISO/R 1326 *IEC 249-2*IEC 249-3*IEC 250*

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发布单位或类别：英国-英国标准学会

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相似标准/计划/法规

BS 4584-103.3-1992

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
印制线路板用金属覆层基材与印刷电路有关的特殊材料印制板制造用永久性聚合物涂层材料（阻焊剂）规范

BS 4584-103.2-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材与印刷电路有关的特殊材料覆铜基材制造用铜箔规范

BS 4584-103.1-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材与印刷电路有关的特殊材料多层印制板制造中用作粘合片材料的预浸料规范

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

BS EN 61249-3-3-1999

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
互连结构材料包覆和未包覆的非增强基材分规范集（适用于柔性印制板）涂有粘合剂的柔性聚酯薄膜涂胶柔性聚酯薄膜

IEC 61249-3-4-1999

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
印制板和其他互连结构用材料.第3-4部分:包层和非包层（用于柔性印制板）无增强基材的分规范集.涂有粘合剂的柔性聚酰亚胺薄膜

IEC 61249-3-3-1999

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
印制板和其他互连结构用材料.第3-3部分:包覆和非包覆（柔性印制板用）无增强基材的分规范集.涂粘合剂的柔性聚酯薄膜

UNE-EN 61249-3-4-2000

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
印制板和其他互连结构用材料第3-4部分:覆层和非覆层（用于柔性印制板）无加强基材分规范集胶粘剂涂覆柔性聚酰亚胺薄膜

UNE-EN 61249-3-3-2000

Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
印制板和其他互连结构用材料第3-3部分:覆层和非覆层（用于柔性印制板）非增强基材分规范集涂有粘合剂的柔性聚酯薄膜

MIL MIL-S-13949/31

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
基材BI（非织造芳纶增强、聚酰亚胺树脂、金属包覆或非包覆）层压印刷线路板薄板（无S/S文件）

MIL MIL-S-13949/31 Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
片材印刷线路板层压基材BI（非织造芳纶增强材料聚酰亚胺树脂金属包覆或未包覆）（无S/S文件）

MIL MIL-P-13949/8D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/8C）（无S/S文件）

MIL MIL-P-13949/8D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GT 玻璃基编织聚四氟乙烯树脂阻燃覆铜（取代MIL-P-13949/8C）（无S/S文件）

MIL MIL-P-13949/8D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片层压材料金属层（印刷线路板）基材GT 玻璃基 WOVEN 聚四氟乙烯树脂耐火树脂铜箔（取代MIL-P-13949/8C）（NO S/S文件）

MIL MIL-P-13949/6D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
覆铜阻燃聚四氟乙烯树脂无纺布基材GP玻璃基金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/6C）（无S/S文件）

MIL MIL-P-13949/6D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
塑料片层压材料金属层（印刷线路板）基材GP 玻璃基非织造布聚四氟乙烯树脂耐火树脂铜箔（取代MIL-P-13949/6C）（无S/S文件）

MIL MIL-P-13949/6D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GP 玻璃基无纺布聚四氟乙烯树脂阻燃覆铜（取代MIL-P-13949/6C）（无S/S文件）

MIL MIL-P-13949/6D Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GP 玻璃基无纺布聚四氟乙烯树脂阻燃覆铜（取代MIL-P-13949/6C）（无S/S文件）

MIL MIL-P-13949/14A

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板（用于印制线路板）基材GY 玻璃基编织聚四氟乙烯树脂阻燃（取代MIL-P-13949/14）（无S/S文件）

MIL MIL-P-13949/7E

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板（用于印制线路板）基材GF 玻璃基无纺布聚四氟乙烯树脂阻燃（代替MIL-P-13949/7D）（无S/S文件）

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