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作废 SJ/T 11030-1996
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电子器件用金铜及金镍钎焊料的分析方法 双硫腙分光光度法测定铅 Methods of analysis for gold-copper and gold-nickel brazing for electronic devices--Determination of lead (spectrophotometric dithizone method)
发布日期: 1996-11-20
实施日期: 1997-01-01
废止日期: 2016-04-01
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现行
SJ/T 11030-2015
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现行
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YS/T 1208.2-2017
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现行
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现行
YS/T 1086-2015
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现行
YS/T 923.1-2013
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现行
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现行
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现行
GB/T 43607-2023
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现行
YS/T 1119-2016
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Methods for chemical analysis of sponge platinum—Determanation of magnesium,aluminium,silicon,chromium,manganese,iron,nickel,copper,zinc,ruthenium,rhodium,silver,tin,iridium,platinum,gold,lead,bismuth content—Inductivety coupled plasma mass spectrometry
2016-07-11
现行
YS/T 1121.2-2016
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