1.1本规范涵盖了用于工程目的的银电镀层的要求，这些镀层可以是无光、光亮或半光亮的，且银纯度不低于98%。 1.2本规范涵盖的银涂层通常用于可焊表面、电接触特性、高导电性和导热性、热压粘接、承载表面的耐磨性和光谱反射率。 1.3附录中简要描述了电沉积银涂层的重要特性，在工程应用中使用时必须考虑这些特性，即电导率（见附录X1）、银迁移（见附录X2）、厚度（见附录X3）、硬度（见附录X4）和大气变色（见附录X5）。 1.4 以下危险警告仅适用于本规范的测试方法部分: 本标准无意解决与其使用相关的安全问题（如有）。本标准的用户有责任在使用前制定适当的安全和健康实践，并确定监管限制的适用性。

1.1 This specification covers requirements for electrodeposited coatings of silver used for engineering purposes that may be mat, bright, or semibright and are not less than 98 % silver purity. 1.2 Coatings of silver covered by this specification are usually employed for solderable surfaces, electrical contact characteristics, high electrical and thermal conductivity, thermocompression bonding, wear resistance of load-bearing surfaces, and spectral reflectivity. 1.3 In the Appendixes important characteristics of electrodeposited silver coatings are briefly described which must be considered when used in engineering applications, namely electrical conductivity (see Appendix X1), silver migration (see Appendix X2), thickness (see Appendix X3), hardness (see Appendix X4), and atmospheric tarnish (see Appendix X5). 1.4 The following hazards caveat pertains only to the test methods section of this specification: This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.