BS EN 60068-2-58. Environmental testing. Part 2-58. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
英国标准EN 60068-2-58 环境测试 第2-58部分 测验 测试Td 表面安装器件(SMD)的可焊性、耐金属化物溶解性和耐焊接热的试验方法
Cross References:IEC 60068-1IEC 60068-2-20:2008IEC 60194IEC 61190-1-1IEC 61190-1-2:2007IEC 61190-1-3:2007/AMD1:2010IEC 61191-2IEC 61249-2-7IEC 61760-1All current amendments available at time of purchase are included with the purchase of this document.