SMT组件通常进行机械弯曲和冲击试验，以确保其能够承受预期的生产、搬运和最终使用条件。在弯曲和冲击试验期间，施加在SMT组件上的应变和应变率会导致焊点附近出现多种失效模式。本文件提供了测试方法，以评估印制板组件（PBA）材料和设计对表面贴装技术（SMT）连接焊盘下方的内聚性介电故障的敏感性。测试方法包括销拉力、球拉力和球剪切，可用于排序和比较不同印制板材料和设计参数。

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.