IEC？61191-4:20 17（E）规定了端子焊接组件的要求。这些要求涉及完全是端子/导线互连结构的那些组件，或者涉及包括其他相关技术（即表面安装、通孔安装、芯片安装）的那些组件的端子/导线部分。 与上一版相比，此版本包括以下重大技术变更: 已更新要求以符合IPC中的验收标准？A-610F。

IEC？61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC？A-610F.