IEC 60317-23:20 13规定了180级可焊接漆包圆铜绕组线的要求，其底涂层基于聚酯酰亚胺树脂，只要其保留原始树脂的化学特性并满足所有规定的电线要求，则可以对其进行改性。注-改性树脂是经过化学变化的树脂，或含有一种或多种添加剂以增强某些性能或应用特性的树脂。本标准涵盖的公称导体直径范围为: -1级:0,020 mm至1,600 mm并包括1,600 mm； -2级:0,020毫米至1,600毫米（含1,600毫米）。IEC 60317-0-1:20 13第4条规定了标称导体直径。本第三版取消并取代了1990年出版的第二版、修正案1:19 97和修正案2:1999.本版是技术性修订。与上一版相比，此版本包括以下重大技术变更: -新的3.2.2载有关于绕组线的一般说明，以前是范围的一部分； -修订IEC 60317-0-1:20 13的参考文献，以阐明其应用是规范性的； -合并17.1和17.2的可焊性要求； -对条款19的修改，介电耗散系数； -新订的第23条，针孔测试。 关键词:可焊漆包圆铜绕组线要求，180级，聚酯酰亚胺树脂基底涂层

IEC 60317-23:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a sole coating based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:
- Grade 1: 0,020 mm up to and including 1,600 mm;
- Grade 2: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This third edition cancels and replaces the second edition published in 1990, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- modification to Clause 19, Dielectric dissipation factor;
- new Clause 23, Pin hole test. Keywords: requirements of solderable enamelled round copper winding wire, class 180, sole coating based on polyesterimide resin