20062737-T-339-申请合并《有贯穿连接的单、双面挠性印制板技术条件》和《无贯穿连接的单、双面挠性印制板技术条件》等两项国家标准计划，合并后项目名称变更为“单、双面挠性印制板分规范”-国家数字标准馆

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申请合并《有贯穿连接的单、双面挠性印制板技术条件》和《无贯穿连接的单、双面挠性印制板技术条件》等两项国家标准计划，合并后项目名称变更为“单、双面挠性印制板分规范” Sectional specification for single & double sided flexible printed board

下达日期： 2005-12-30

分类信息

发布单位或类别：中国-国家标准计划

CCS分类： FL30

ICS分类： 31.180电子学 - 印制电路和印制电路板

关联关系

研制信息

归口单位：全国印制电路标准化技术委员会

起草单位：福建闽威电路板实业有限公司、珠海元盛电子科技股份有限公司

起草人：朱民、何波

相似标准/计划/法规

GB/T 14515-2019

单、双面挠性印制板分规范
Sectional specification for single and double sided flexible printed board

System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
质量评估体系分规范带贯穿连接的柔性单面和双面印制板

System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
质量评估体系分规范无贯穿连接的柔性单面和双面印制板

UNE 20621-8-1985

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
印制板带贯穿连接的单面和双面柔性印制板规范

UNE 20621-7-1985

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
印制板无贯穿连接的单面和双面柔性印制板规范

System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
质量评估体系分规范带普通孔的刚性单面和双面印制板

BS 123500-003-2001

System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
质量评估体系能力详细说明带贯穿连接的柔性单面和双面印制板

BS 123400-003-2001

System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
质量评估体系能力详细说明无贯穿连接的柔性单面和双面印制板

Sectional specification: single and double sided printed boards with plain holes; german version EN 123100:1992
分规范:带平孔的单面和双面印制板；德文版EN 123100:1992

Sectional specification: single and double sided printed boards with plated-through holes; german version EN 123200:1992
分规范:带电镀通孔的单面和双面印制板；德文版EN 123200:1992

BS EN 123100-1992

Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
电子元件质量评定协调体系:分规范:带平孔的单面和双面印制板

BS EN 123200-1992

Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
电子元件质量评定协调体系:分规范:带电镀通孔的单面和双面印制板

BS 96/213356 DC

IEC 2326-3. Printed boards. Part 3. Rigid single and double sided printed boards with interlayer connections. Sectional specification. 52/676/CD
IEC 2326-3 印制板第三部分带有夹层连接的刚性单面和双面印制板分规范 52/676/CD

BS 96/213354 DC

IEC 2326-2. Printed boards. Part 2. Rigid single and double-sided printed boards without interlayer connections. Sectional specification. 52/674/CD
IEC 2326-2 印制板第二部分无夹层连接的刚性单面和双面印制板分规范 52/674/CD

BS 96/213357 DC

IEC 2326-3-1. Printed boards. Part 3. Rigid single and double sided printed boards with interlayer connections. Section 1. Capability detail specification. Performance level A, B, and C. 52/677/CD. Capability detail specification - Performance levels A, B and C
IEC 2326-3-1 印制板第三部分带有夹层连接的刚性单面和双面印制板第一节能力详细说明性能等级A、B和C 52/677/CD 能力详细规范-性能等级A、B和C

BS 96/213355 DC

IEC 2326-2-1. Printed boards. Part 2. Rigid single and double sided printed boards without interlayer connections. Section 1. Capability detail specification. Performance level A, B and C. 52/674/CD. Capability detail specification - Performance levels A, B and C
IEC 2326-2-1 印制板第二部分无夹层连接的刚性单面和双面印制板第一节能力详细说明 A、B和C级性能52/674/CD 能力详细规范-性能等级A、B和C

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