本规范涵盖环氧树脂浸渍玻璃纤维布层压板，其形式为单面或双面覆有电解沉积铜箔的薄板。主要用于要求低吸湿性和高粘合强度的电气和电子设备中使用的蚀刻印刷电路。

This specification covers epoxy-resin-impregnated glass fabric laminates in the form of sheet clad on one or both sides with electrolytically-deposited copper foil. Primarily for use in etched, printed circuits used in electrical and electronic equipment where low moisture absorption and superior bond strength are required.