现行

MIL MIL-R-9299C Notice 2-Cancellation

RESIN, PHENOLIC, LAMINATING (SUPERSEDING MIL-R-9299B) (NO S/S DOCUMENT)
层压酚醛树脂（取代MIL-R-9299B）（无S/S文件）

1998-11-24

现行

MIL MIL-R-9299C Notice 1-Validation

RESIN, PHENOLIC, LAMINATING (SUPERSEDING MIL-R-9299B) (NO S/S DOCUMENT)
层压酚醛树脂（取代MIL-R-9299B）（无S/S文件）

1991-10-24

现行

MIL MIL-R-15189B

RESIN, ALKYD PHENOLIC (NO S/S DOCUMENT) (SUPERSEDING MIL-R-15189A)
醇酸酚醛树脂（无S/S文件）（代替MIL-R-15189A）

1986-09-09

现行

MIL MIL-R-15189B Notice 1-Cancellation

RESIN, ALKYD PHENOLIC (NO S/S DOCUMENT) (SUPERSEDING MIL-R-15189A)
醇酸酚醛树脂（无S/S文件）（取代MIL-R-15189A）

1996-05-02

现行

MIL MIL-R-21931A

RESIN, EPOXY (NO S/S DOCUMENT) (SUPERSEDING MIL-R-21931)
环氧树脂（无S/S文件）（取代MIL-R-21931）

1977-01-05

现行

MIL MIL-R-21931A Notice 1-Cancellation

RESIN, EPOXY (NO S/S DOCUMENT) (SUPERSEDING MIL-R-21931)
环氧树脂（无S/S文件）（取代MIL-R-21931）

1992-05-20

现行

MIL MIL-R-82483A

RESIN, POLYESTER, SOLUTIONS (NO S/S DOCUMENT) (SUPERSEDING MIL-R-82483)
聚酯树脂溶液（无S/S文件）（取代MIL-R-82483）

1976-03-10

现行

MIL MIL-R-82483A Notice 1-Cancellation

RESIN, POLYESTER, SOLUTIONS (NO S/S DOCUMENT) (SUPERSEDING MIL-R-82483)
聚酯树脂溶液（无S/S文件）（取代MIL-R-82483）

1996-10-15

现行

FED TT-R-271C

RESIN, PHENOL-FORMALDEHYDE (PARA-PHENYL AND PARA-BUTYL) (NO S/S DOCUMENT) (SUPERSEDING TT-R-271B)
酚醛树脂（对苯基和对丁基）（无S/S文件）（替代TT-R-271B）

1975-03-12

现行

MIL MIL-C-3154A

CLOTH, COATED, COTTON (CREPED, PHENOLIC RESIN TREATED) (NO S/S DOCUMENT) (SUPERSEDING MIL-C-3154)
棉质涂层布（绉纹 酚醛树脂处理）（无S/S文件）（替代MIL-C-3154）

1971-09-16

现行

MIL MIL-C-3154A Notice 1-Cancellation

CLOTH, COATED, COTTON (CREPED, PHENOLIC RESIN TREATED) (NO S/S DOCUMENT) (SUPERSEDING MIL-C-3154)
棉布涂层布（起皱 酚醛树脂处理）（无S/S文件）（代替MIL-C-3154）

1996-10-15

现行

MIL MIL-P-15035C Amendment 4

PLASTIC SHEET: LAMINATED, THERMOSETTING, COTTON-FABRIC-BASE, PHENOLIC-RESIN (S/S BY MIL-I-24768/13, MIL-I-24768/14, MIL-I-24768/15 AND MIL-I-24768/16) (SUPERSEDING MIL-P-15035B)
塑料片:层压 热固化 棉织物基 酚醛树脂（MIL-I-24768/13 MIL-I-24768/14 MIL-I-24768/15和MIL-I-24768的S/S/16）（取代MIL-P-15035B）

1984-05-01

现行

MIL MIL-S-13949/22B

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
基材BF层压印刷线路板（非纺织芳纶增强、环氧树脂、金属包覆或非包覆）（替代MIL-S-13949/22A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/22B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/22B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/25B

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/25A) (NO S/S DOCUMENT)
基材CF层压印刷线路板板材（无纺聚酯、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/25A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/25B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/25A) (NO S/S DOCUMENT)
层压印刷线路板薄板 基材CF（无纺聚酯、环氧树脂、阻燃、金属包覆或非包覆）（取代MIL-S-13949/25A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/15C

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
基材AF层压印刷线路板（编织芳纶增强、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/15B）（无S/S文件）

1993-03-28

现行

MIL MIL-S-13949/19A

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
基材QI层压印刷线路板（编织石英增强、聚酰亚胺树脂、耐热、金属包覆或非包覆）（替代MIL-S-13949/19）（无S/S文件）

1993-12-06

现行

MIL MIL-S-13949/19A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材QI（编织石英增强 聚酰亚胺树脂 耐热 金属包覆或未包覆）（取代MIL-S-13949/19）（无S/S文件）

1997-08-01