MIL MIL-PRF-31032/4B Amendment 2-焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板-国家数字标准馆

现行 MIL MIL-PRF-31032/4B Amendment 2

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Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting 焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

发布日期： 2013-06-24

本规范涵盖了多层（三层或三层以上导体层）刚性-柔性或柔性（带或不带加强件）印制线路板（以下简称印制板）的一般性能要求，该印制线路板具有将使用焊接进行部件/零件安装的镀孔（见6.1.1）。

This specification covers the generic performance requirements for multilayered (three or more conductor layers) rigid-flex or flexible (with or without stiffeners) printed wiring boards (hereafter designated printed board) with plated holes that will use soldering for component/part mounting (see 6.1.1).

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发布单位或类别：美国-美国军事规范和标准

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研制信息

相似标准/计划/法规

BS 6221-11-1991

Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板带贯穿连接的挠性-刚性多层印制板规范

MIL MIL-PRF-31032/4A Amendment 4

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

MIL MIL-PRF-31032/4B Amendment 1

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

MIL MIL-PRF-31032/4C Amendment 2

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

MIL MIL-PRF-31032/4A Amendment 3

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

MIL MIL-PRF-31032/4C Amendment 1

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

MIL MIL-PRF-31032/4D

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
多层印刷线路板刚柔带电镀通孔带或不带加强筋用于焊接部件安装

MIL MIL-PRF-50884G

Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
柔性或刚性柔性印刷线路板通用规范

MIL MIL-PRF-31032/4A Amendment 1

PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/4)
打印接线板刚性柔性或柔性多层带有孔的具有或不具有强度的用于焊接的部件安装（取代MIL-PRF-31032/4）

MIL MIL-PRF-31032/4A Amendment 2

PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/4)
焊接部件安装用刚性-柔性或柔性多层印制线路板带镀层孔带或不带加强件（代替MIL-PRF-31032/4）

QPL QPL-50884-59

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR(SUPERSEDING QPL-50884-58)
挠性或硬挠性印制线路板通用规范（代替QPL-50884-58）

MIL MIL-P-50884E Notice 3-Amendment 3

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884D)
柔性或硬柔性印刷线路板通用规范（代替MIL-P-50884D）

MIL MIL-P-50884E Notice 1-Amendment 1

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884D)
柔性或硬柔性印刷线路板通用规范（代替MIL-P-50884D）

MIL MIL-P-50884D Notice 1-Amendment 1

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884C)
柔性或硬柔性印刷线路板通用规范（代替MIL-P-50884C）

QPL QPL-50884-59

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR(SUPERSEDING QPL-50884-58)
挠性或硬挠性印制线路板通用规范（代替QPL-50884-58）

MIL MIL-P-50884D Notice 2-Amendment 2

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884C)
挠性或硬挠性印制电路板通用规范（代替MIL-P-50884C）

MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
印刷电路板刚性多层热固性树脂基材带或不带盲孔和埋地电镀通孔用于焊接部件安装

MIL MIL-PRF-31032/1C Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板带或不带盲板和埋板通孔

MIL MIL-PRF-31032/5 Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
用于高频应用的带有镀通孔的刚性、多层、热塑性、热固性或热塑性和热固性树脂基材印刷线路板

MIL MIL-PRF-31032/1B Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板带或不带盲板和埋板通孔

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