本规范涵盖薄膜或糊状的高温电气级聚酰亚胺树脂粘合剂。本产品通常用作粘合雷达透明组件中聚酰亚胺层压夹层结构的粘合剂，但用途不限于此类应用。这种粘合剂在-55摄氏度至+315摄氏度（-67摄氏度至+600华氏度）的温度范围内都很有用。

This specification covers a high-temperature, electrical-grade, polyimide resin adhesive in the form of film or paste. This product has been used typically as an adhesive for bonding polyimide-laminate-faced sandwich structures in radar-transparent assemblies, but usage is not limited to such applications. The adhesive is useful over the temperature range -55 degrees to +315 degrees C (-67 degrees to +600 degrees )F.