Cases 200 A 3 and 200 B 3 for semiconductor devices; main dimensions
半导体器件的案例200A3和200B3；主要尺寸

1971-03-01

Cases 1 A 2 and 1 A 3 for semiconductor devices; main dimensions
案例1 A 2和案例1 A 3适用于半导体器件；主要尺寸

1971-01-01

Case 118 A 2 for semiconductor devices; main dimensions
案例118 A 2适用于半导体器件；主要尺寸

1971-03-01

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
半导体器件的机械标准化.第6-3部分:表面安装半导体器件封装外形图绘制的一般规则；quat扁平包装（QFP）包装尺寸的测量方法（IEC 60191-6-3-2000）；德文版EN 60191-6-3:2000

2001-06-01

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
半导体器件的机械标准化 - 第6-3部分:表面贴装半导体器件封装外形图的一般规则 - 四方扁平封装的封装尺寸测量方法（qfp）

2000-09-29