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现行 KS C 62137-1-4-2024
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표면실장기술 — 표면실장 솔더 접합부에 대한 환경 및 내구성 시험방법 — 제1-4부: 반복 굽힘 시험 表面安装技术表面安装焊点的环境和耐久性试验方法第1-4部分:循环弯曲试验
发布日期: 2024-06-07
该标准中描述的试验方法适用于具有QFP和BGA等薄而宽的基面的表面贴装零件。该试验方法通过基板的反复弯曲来评估基板的零件导轨和兰德之间的焊接接头的耐久性。该试验还评估反复机械压力的影响,如在手机上按键,以及零件端子和基板的兰德之间的焊点接合强度。在该试验方法中,评价要求先用回弹焊在基板上安装表面贴装零件,然后反复弯曲基板,直到焊接接头破损。评估结果显示,焊接接头的特性(如焊接合金、基板、实装配件或设计等)有助于改善焊接接头的强度。
이 표준에 설명된 시험방법은 QFP 및 BGA와 같은 얇고 넓은 기저면이 있는 표면실장부품에 적용된다. 이 시험방법은 기판의 반복적인 굽힙에 의해 기판의 부품 리드와 랜드 사이의 솔더 접합부의 내구성을 평가한다. 이 시험은 또한 휴대폰에서 키를 누르는 것과 같은 반복적인 기계적 스트레스의 영향, 부품 단자와 기판의 랜드 사이의 솔더 접합 강도를 평가한다. 이 시험방법에서 평가는 먼저 리플로 땜질로 기판에 표면실장부품을 실장한 다음 솔더 접합부가 파손될 때까지 기판을 일정한 깊이로 반복적으로 구부리는 것을 요구한다. 솔더 접합부의 특성(예: 솔더 합금, 기판, 실장 부품 또는 디자인 등)은 솔더 접합부의 강도를 개선하는 데 도움이 되도록 평가된다.
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