IEC 61188-5-8:20 07提供了关于焊球、焊柱或保护性涂层焊盘形式的面阵终端的电子元件表面附着的焊盘图案几何形状的信息。本文中呈现的信息的意图是提供表面安装焊盘图案的适当尺寸、形状和公差，以确保用于适当焊点的足够面积，并且还允许那些焊点的检查、测试和返工。 本出版物应与IEC 61188-5-1:20 02一起阅读。

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1:2002.