Technical drawings - General tolerances in mechanical engineering - Tolerance rule and general plan
技术制图.机械工程中的一般公差.公差规则和总平面图

2008-03-01

Technical product documentation (TPD). General principles of presentation-Simplified representation for mechanical engineering drawings
技术产品文档（TPD） 介绍的一般原则

2011-04-30

Technical product documentation (TPD) — General principles of presentation — Part 71: Simplified representation for mechanical engineering drawings
技术产品文档（TPD）——表示的一般原则第71部分:机械工程图纸的简化表示

2010-08-19

Draft Document - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)
文件草案.半导体器件的机械标准化.第6-1部分:表面安装半导体器件封装外形图绘制的一般规则.鸥翼引线端子的设计指南（IEC 47D/770/CD:2010）

2010-07-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
文件草案.半导体器件的机械标准化.第6-5部分:表面安装半导体器件封装外形图绘制的一般规则.细间距球栅阵列（FBGA）的设计指南（IEC 47D/755/CD:2009）

2010-01-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
文件草案.半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 47D/733/CD:2008）

2009-02-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
文件草案.半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）的封装尺寸测量方法（IEC 47D/732/CD:2008）

2009-02-01