IEC 62137-4:20 14规定了安装在印刷线路板上的面阵型封装焊点的测试方法，以评估焊点对热机械应力的耐久性。 IEC 62137的这一部分适用于具有区域阵列型封装（FBGA、BGA、FLGA和LGA）的表面安装半导体器件，包括外围终端型封装（SON和QFN），旨在用于工业和消费电气或电子设备。相对于IEC 62137:2004，IEC 62137-4包括以下重大技术变更: -包括使用无铅焊料的测试条件； -增加了无铅焊料的测试条件； -增加了焊点温度循环试验的加速度。

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004:
- test conditions for use of lead-free solder are included;
- test conditions for lead-free solders are added;
- accelerations of the temperature cycling test for solder joints are added.