本文件适用于为最终过渡到航空航天平台而开发的离散和集成数字、波分复用（WDM）和模拟/射频（RF）光子组件。该文件提供了验证光子器件寿命测试和封装耐久性的理由。本文件侧重于光学元件级别的资格预审活动，以实现TRL 6。本文件中推荐的试验旨在激发航空航天操作环境中光子器件遇到的典型故障机制，并建立在项目工程和制造开发阶段技术合格的信心。 本推荐做法针对支持电到光、光到电或光到光功能的组件。包括无源光波导、光纤电缆和集成到光子封装中的连接器组件。组件和光子封装的辐射耐受性要求不在本推荐规程的范围内。

This document is intended for discrete and integrated digital, wavelength division multiplexing (WDM), and analog/radio frequency (RF) photonic components developed for eventual transition to aerospace platforms. The document provides the reasons for verification of photonic device life test and packaging durability. The document focuses on pre-qualification activity at the optical component level to achieve TRL 6. The recommended tests in this document are intended to excite typical failure mechanisms encountered with photonic devices in an aerospace operating environment, and to build confidence that a technology is qualifiable during a program’s engineering and manufacturing development phase.This recommended practice is targeting components to support electrical-to-optical, optical-to-electrical, or optical-to-optical functionality. Passive optical waveguide, fiber optic cable, and connector components that are integral to a photonic package are included. Component and photonic package radiation tolerance requirements are not within the scope of this recommended practice.