1.1 本规范涵盖电子应用中使用的58型硼硅酸盐密封玻璃。 注1: 本规范主要旨在考虑最常用的玻璃，即制造电子设备时通常遇到的透明形式的玻璃。 X1.3 指与该玻璃兼容的密封合金。不包括其他形式的58型玻璃，如粉末、压碎、烧结、纤维等。本规范中适用于这些形状的要求必须在转换前在原玻璃中确定。 1.2 本国际标准是根据世界贸易组织技术性贸易壁垒（TBT）委员会发布的《关于制定国际标准、指南和建议的原则的决定》中确立的国际公认标准化原则制定的。

1.1 This specification covers Type 58 borosilicate sealing glass for use in electronic applications. Note 1: This specification is primarily intended to consider glass as most generally used, that is, glass in its transparent form as normally encountered in fabricating electronic devices. X1.3 refers to a sealing alloy that is compatible with this glass. Type 58 glass in other forms such as powdered, crushed, sintered, fibrous, etc., are excluded. The requirements of this specification, as applied to these forms, must be established in the raw glass prior to its conversion. 1.2 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.