JIS C 60068-2-69:2019概述了测试Te（印制板的可焊性测试）和测试Tc[通过平衡法进行的可焊性测试，以及基于定量评估标准（润湿时间和润湿性）的评估]、锡槽润湿平衡法和焊球润湿平衡法，以定量确定，电子元件和印制板上终端的可焊性。通过这些方法获得的数据不打算用作通过-失败目的的绝对定量数据。

JIS C 60068-2-69:2019 outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations on electronic components and printed boards. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.