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Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化
发布日期: 2018-05-30
包含以下内容:2018年5月修正案
Incorporates the following:Amendment, May 2018
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发布单位或类别: 英国-英国标准学会
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