本文件规定了非导电基材上导电涂层厚度的无损测量方法。该方法基于薄片电阻率测量原理，适用于金属和半导体材料的任何导电涂层和层。一般来说，探头必须根据各自应用的导电性和厚度进行调整。然而，本文件主要关注非导电基材上的金属涂层（例如。 g、 塑料基板、印刷电路板上的铜）。 如果涂层和基材的电阻率显著不同，该方法也适用于导电基材上导电涂层的厚度测量。然而，本文件不考虑这种情况。

This document specifies a method for non-destructive measurements of the thickness of conductive coatings on non-conductive base materials. This method is based on the principle of the sheet resistivity measurement and is applicable to any conductive coatings and layers of metal and semiconductor materials. In general, the probe has to be adjusted to the conductivity and the thickness of the respective application. However, this document focuses on metallic coatings on non-conductive base materials (e.g. copper on plastic substrates, printed circuit boards). This method is also applicable to thickness measurements of conductive coatings on conductive base materials, if the resistivity of the coating and the base material is significantly different. However, this case is not considered in this document.