现行

GB/T 44555-2024

电子凭证 会计档案封装技术要求
Electronic credential—Technical requirements for encapsulation of accounting archives

2024-08-23

现行

T/CIET 432-2024

建筑用光伏组件封装胶膜技术要求

2024-03-22

现行

SC/T 8084-1994

渔船轴系轴承及密封装置技术要求

1994-11-01

现行

GOST 31315-2015

Устройства пломбировочные электронные. Общие технические требования
电子密封装置 一般技术要求

2015-10-27

现行

T/CI 435-2024

钙钛矿电池用封装设备技术要求

2024-08-01

现行

GB/T 43538-2023

集成电路金属封装外壳质量技术要求
Quality and technical requirements for metal packages used for integrated circuits

2023-12-28

现行

SJ 21401-2018

微电子封装陶瓷外壳磨边及裂片工艺技术要求
Ceramic packages for microelectronics packaging-Technical requirements for edge-grinding and splitting process

2018-01-18

现行

SJ 21455-2018

集成电路陶瓷封装合金烧结密封工艺技术要求
Integrated circuit ceramic package-Technical requirements for sealing process with alloy-sintering

2018-01-18

现行

SJ 21453-2018

集成电路陶瓷封装金丝键合工艺技术要求
Integrated circuit ceramic package-Technical requirements for gold wire bonding process

2018-01-18

现行

SJ 21451-2018

集成电路陶瓷封装圆片划片工艺技术要求
Integrated circuit ceramic package-Technical requirement for wafer-sawing process

2018-01-18

现行

YD/T 3071-2016

接入网技术要求 SFP/SFP+封装的PON ONU

2016-04-05

现行

T/WAPIA 024-2024

信息安全技术 三元可扩展鉴别协议消息封装扩展要求

2024-01-26

现行

SJ 21408-2018

微电子封装陶瓷外壳 激光切割及打标工艺技术要求
Ceramic packages for microelectronic packaging-Technical requirements for laser cutting and laser marking process

2018-01-18

现行

SJ 21454-2018

集成电路陶瓷封装硅铝丝键合工艺技术要求
Integrated circuit ceramic package-Technical requirements for aluminum-silicon wire bonding process

2018-01-18

现行

SJ 21403-2018

微电子封装金属外壳玻璃绝缘子工艺技术要求
Metal packages for microelectronic packaging-Technical requirements for the manufacturing process of glass insulator

2018-01-18

现行

SJ 21405-2018

微电子封装金属外壳铝硅外壳镀覆工艺技术要求
Metal packages for microelectronic packaging-Technical requirements for the plating process of aluminium-silicon alloy packages

2018-01-18

现行

SJ 21450-2018

集成电路陶瓷封装圆片减薄工艺技术要求
Integrated circuit ceramic package-Technical requirement for wafer-thinning process

2018-01-18

现行

SJ 21452-2018

集成电路陶瓷封装芯片胶粘接装片工艺技术要求
Interated circuit ceramic package-Technical requirements for die-attachment process by adhesives

2018-01-18

现行

T/CASME 1447-2024

半导体与电子领域封装用高精度智能视觉检测机通用技术要求

2024-04-28

现行

SJ 21407-2018

微电子封装陶瓷及金属外壳零件清洗工艺技术要求
Ceramic and metal packages for microelectronic packaging-Technical requirements for parts cleaning process

2018-01-18