INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, SEMI-RIGID, FOR DIP PROCESSING, GRADE SHT, CLASS 155 TO 200 THERMAL CLASS (SUPERSEDING MIL-I-24092/8)
浸渍加工用半刚性无溶剂触变烘焙绝缘树脂 SHT级 155至200级 热级（代替MIL-I-24092/8）

1993-09-21

INSULATING RESIN, SOLVENTLESS, BAKING, FLEXIBLE, FOR DIP PROCESSING, GRADE SF, CLASS 130 TO 180 THERMAL CLASS (SUPERSEDING MIL-I-24092/5)
浸渍加工用柔性无溶剂烘焙绝缘树脂 SF级 130至180级 热级（取代MIL-I-24092/5）

1993-09-21

INSULATING RESIN, SOLVENTLESS, SILICONE, BAKING, FOR DIP PROCESSING, GRADE SS, CLASS 180 TO 220 THERMAL CLASS (SUPERSEDING MIL-I-24092/9)
浸渍加工用无溶剂硅酮烘焙绝缘树脂 SS级 180至220级 热级（取代MIL-I-24092/9）

1993-09-21

INSULATING RESIN, SOLVENTLESS, BAKING, SEMI-RIGID, FOR DIP PROCESSING, GRADE SH, CLASS 155 TO 200 THERMAL CLASS (SUPERSEDING MIL-I-24092/7)
浸渍处理用半刚性无溶剂烘烤绝缘树脂 SH级 155至200级 热级（代替MIL-I-24092/7）

1993-09-21