现行

UNE-EN 60249-2-8-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-07-24

现行

UNE-EN 60249-2-8/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-10-23

现行

UNE-EN 60249-2-15-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-07-24

现行

UNE-EN 60249-2-15/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-10-14

现行

UNE-EN 60249-2-2-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14

现行

UNE-EN 60249-2-2/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14

现行

UNE-EN 60249-2-2/A4-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14

现行

UNE-EN 60249-2-13-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-07-24

现行

KS C IEC 60249-2-1(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－제1장：고급형 페놀셀룰로오스 종이 동입힘 적층판
印制电路用基材第2部分:规范第1号规范:高电气质量酚醛纤维素纸覆铜箔层压板

2002-05-30

现行

IEC 61249-2-51-2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
印制板和其他互连结构材料.第2-51部分:包覆和非包覆增强基材.非包覆集成电路卡载带基材

2023-05-11

现行

UNE-EN 60249-2-1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
印刷电路的基材 第2部分:规范 规格1:高电气质量酚醛纤维素纸覆铜箔层压板

1996-07-24

现行

UNE-EN 60249-2-4/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

UNE-EN 60249-2-1/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
印刷电路的基材 第2部分:规范 规格1:高电气质量酚醛纤维素纸覆铜箔层压板

1996-10-09

现行

UNE-EN 60249-2-4-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

UNE-EN 60249-2-1/A2-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICAION Nº1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
印刷电路的基材 第2部分:规范 规格1:酚醛纤维素纸覆铜层压板 高电气质量

1996-10-14

现行

KS C IEC 60249-2-7(2017 Confirm)

인쇄 회로 기판 재료－ 제2부：규격－제7장：가연성 페놀셀룰로오스 종이 동입힘 적층판 (수직 연소 시험)
印制电路用基材第2部分:规范第7号规范:规定可燃性的酚醛纤维素纸覆铜层压板（垂直燃烧试验）

2002-05-30

现行

UNE-EN 60249-2-4/A4-1996

BASE MATERIAL FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

UNE-EN 60249-2-17-1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
印刷电路的基材 第2部分:规范 规范Nº17:多层印制板制造用规定可燃性的薄聚酰亚胺编织玻璃纤维覆铜层压板

1997-08-11

现行

UNE-EN 60249-2-12-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范12:多层印制板制造用规定可燃性的薄环氧玻璃纤维织物覆铜层压板

1996-07-24

现行

UNE-EN 60249-2-3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 3: EPOXIDE CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
印刷电路的基材 第2部分:规范 规范3:规定可燃性的环氧纤维素纸覆铜层压板（垂直燃烧试验）

1996-07-24