SECTIONAL SPECIFICATION FOR MULTI-PACKAGE MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用多封装模块插座分规范

1997-11-06

DETAIL SPECIFICATION FOR MULTI-PACKAGE 50 MIL PITCH, VERTICAL MOUNTING FORMAT MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用50密耳间距、垂直安装格式的多组件模块插座详细规范

2001-10-24

DETAIL SPECIFICATION FOR MULTI-PACKAGE 50 MIL PITCH, ANGLED MOUNTING FORMAT MODULE SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用50密耳螺距、角度安装格式的多组件模块插座详细规范

2001-10-24

BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC QUAD FLAT PACKAGES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用塑料方形扁平封装芯片载体插座空白详细规范

1997-11-06

BLANK DETAIL SPECIFICATION FOR BURN-IN SOCKETS FOR CHIP CARRIER PACKAGES WITH MOLDED CARRIER RINGS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用模制载体环芯片载体封装用老化插座空白详细规范

2001-04-06

BLANK DETAIL SPECIFICATION FOR CHIP CARRIER SOCKETS FOR PLASTIC CHIP CARRIER (PCC) PACKAGES WITH "J" TYPE LEADS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用带“J”型引线的塑料芯片载体（PCC）封装芯片载体插座空白详细规范

1997-11-06