IEC 61191-2:20 17（E）给出了表面贴装焊接连接的要求。这些要求涉及完全表面安装的那些组件或包括其他相关技术（例如通孔、芯片安装、端子安装等）的那些组件的表面安装部分。 与上一版相比，此版本包括以下重大技术变更: a）要求已更新，以符合IPC中的验收标准？A-610F; b)文件中使用的一些术语已经更新； c)已更正对IEC标准的引用； d)增加了五种终止样式。

IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a)   the requirements have been updated to be compliant with the acceptance criteria in IPC？A-610F;
b)   some of the terminology used in the document has been updated;
c)   references to IEC standards have been corrected;
d)   five termination styles have been added.