本规范涵盖双组分粘合剂化合物、环氧树脂基和硬化剂，其形式为糊状。该化合物通常用于金属和热固性塑料的非结构性粘合、金属和热固性塑料之间的粘合以及在不高于260摄氏度（500华氏度）的温度下工作的电气元件和设备的粘合剂，但用途不限于此类应用。

This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.