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现行 BS EN 60249-2-13:1994
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Base material for printed circuits. Specifications-Flexible copper-clad polyimide film, general purpose grade 印刷电路的基材 规格 通用级挠性覆铜聚酰亚胺薄膜
发布日期: 1990-02-28
交叉引用:BS 4584:第1部分*BS 4584:第103.2节**
Cross References:BS 4584:Part 1*BS 4584:Section 103.2**
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发布单位或类别: 英国-英国标准学会
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现行
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