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现行 MIL MIL-DTL-47113E Notice 1-Validation 1
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Compound, Heat Sink, Silicone and/or Non-Silicone 化合物、散热器、硅树脂和/或非硅树脂
发布日期: 2017-05-10
本规范涵盖硅树脂或非硅树脂散热器化合物,该化合物应用于晶体管和二极管的底座和安装螺柱,以提供正散热器密封。
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
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发布单位或类别: 美国-美国军事规范和标准
关联关系
研制信息
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现行
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