Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
设备嵌入组装技术.第2-5部分:指南.设备嵌入基板三维数据格式的实现

2019-09-16

부품내장조립기술 — 제2-5부: 지침 —부품내장기판용 3D 데이터 형식 구현
器件嵌入组装技术.第2-5部分:指南.器件嵌入基板的3D数据格式的实现

2022-06-28

Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
器件嵌入组装技术.第2-8部分:指南.有源器件嵌入基板的翘曲控制

2021-07-07

부품내장실장기술 — 제2-8부: 지침 — 능동부품 내장기판의 휨 제어
器件嵌入组件技术.第2-8部分:指南.有源器件嵌入衬底的翘曲控制

2022-12-12

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
设备嵌入组装技术.第2-9部分:指南.电子组装技术行业中JISSO水平的概念

2022-04-27

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
器件嵌入组装技术.第2-7部分:指南.无源嵌入电路板的加速应力试验

2019-03-20

부품내장실장기술 — 제2-7부: 지침 —수동내장회로기판의 가속 응력 시험
器件嵌入组装技术.第2-7部分:指南.无源嵌入电路板的加速应力试验

2021-07-26

Device embedded substrate - Part 2-1: Guidelines - General description of technology
设备嵌入式基板.第2-1部分:指南.技术的一般说明

2015-03-30

부품내장기판 — 제2-1부: 지침— 기술의 일반 설명
设备嵌入式基板.第2-1部分:指南.技术的一般描述

2022-06-28

Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
器件嵌入组件技术.第2-10部分:空腔衬底的设计规范

2024-01-31

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
器件嵌入组装技术.第2-602部分:堆叠电子模块指南.模块间电气连接的评估方法

2021-06-22

Draft Document - Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English
文件草案-设备嵌入组装技术-第2-602部分:堆叠电子模块指南-模块间电气连接的评估方法（IEC 91/1629/CD:2019）；德语和英语文本

2020-11-01