Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
互连结构材料 - 第5部分:带和不含涂层的导电箔和薄膜的剖面规格 - 第1节:铜箔(用于制造铜包基材料)
发布日期:
1995-11-28
给出了预期使用的铜箔的性能要求
用于制造覆铜层压板和
覆铜柔性材料,用于制造
印制板。
Gives requirements for properties of copper foil intended for use
in the manufacture of copper-clad laminated sheets and of
copper-clad flexible materials, used in the manufacture of
printed boards.