现行

SJ 21327-2018

陶瓷外壳贴装类装架工艺技术要求
Ceramic packages Technical requirements for assembling process of surface-mounted type

2018-01-18

现行

SJ 21333-2018

陶瓷外壳及金属外壳钎焊工艺技术要求
Ceramic package and metal package Technical requirements for braze process

2018-01-18

现行

SJ 21330-2018

金属外壳 装架工艺技术要求
Metal package Technical requirements for assembling process

2018-01-18

现行

SJ 21334-2018

陶瓷外壳及金属外壳电镀镍工艺技术要求
Ceramic packages and metal packages Technical requirements for nickel electroplating process

2018-01-18

现行

SJ 21407-2018

微电子封装陶瓷及金属外壳零件清洗工艺技术要求
Ceramic and metal packages for microelectronic packaging-Technical requirements for parts cleaning process

2018-01-18

现行

SJ 21402-2018

微电子封装陶瓷及金属外壳纤焊后处理工艺技术要求
Ceramic and metal packages for microelectronics packaging-Technical requirements for processing after brazing

2018-01-18

现行

SJ 21401-2018

微电子封装陶瓷外壳磨边及裂片工艺技术要求
Ceramic packages for microelectronics packaging-Technical requirements for edge-grinding and splitting process

2018-01-18

现行

SJ 21332-2018

陶瓷外壳及金属外壳化学镀镍工艺技术要求
Ceramic packages and metal packages Technical requirements for electroless nickel plating process

2018-01-18

现行

SJ 21408-2018

微电子封装陶瓷外壳 激光切割及打标工艺技术要求
Ceramic packages for microelectronic packaging-Technical requirements for laser cutting and laser marking process

2018-01-18

现行

SJ 21331-2018

陶瓷外壳及金属外壳金属零件热处理工艺技术要求
Ceramic packages and metal packages Technical requirements for the heat treatment of the metal parts process

2018-01-18

现行

SJ 21451-2018

集成电路陶瓷封装圆片划片工艺技术要求
Integrated circuit ceramic package-Technical requirement for wafer-sawing process

2018-01-18

现行

SJ 21450-2018

集成电路陶瓷封装圆片减薄工艺技术要求
Integrated circuit ceramic package-Technical requirement for wafer-thinning process

2018-01-18

现行

SJ 21455-2018

集成电路陶瓷封装合金烧结密封工艺技术要求
Integrated circuit ceramic package-Technical requirements for sealing process with alloy-sintering

2018-01-18

现行

SJ 21453-2018

集成电路陶瓷封装金丝键合工艺技术要求
Integrated circuit ceramic package-Technical requirements for gold wire bonding process

2018-01-18

现行

SJ 21452-2018

集成电路陶瓷封装芯片胶粘接装片工艺技术要求
Interated circuit ceramic package-Technical requirements for die-attachment process by adhesives

2018-01-18

现行

SJ 21454-2018

集成电路陶瓷封装硅铝丝键合工艺技术要求
Integrated circuit ceramic package-Technical requirements for aluminum-silicon wire bonding process

2018-01-18