1.1 本指南提供了安装粘结电阻应变计的指南。它是 不 用于散装或扩散半导体仪表。本指南仅适用于粘接应变计。 1.2 以国际单位制表示的数值应视为标准值。本标准不包括其他计量单位。 1.3 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任在使用前制定适当的安全、健康和环境实践，并确定监管限制的适用性。 1.4 本国际标准是根据世界贸易组织技术性贸易壁垒（TBT）委员会发布的《关于制定国际标准、指南和建议的原则的决定》中确立的国际公认标准化原则制定的。 ====意义和用途====== 4.1 安装粘结电阻应变计的方法和程序可能对这些传感器的性能产生重大影响。最佳且可重复的表面变形检测需要适当且一致的应变计和粘接技术选择、表面处理、量规安装和粘合剂使用程序、引线连接、操作验证和保护涂层应用。

1.1 This guide provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This guide pertains only to adhesively bonded strain gages. 1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. ====== Significance And Use ====== 4.1 Methods and procedures used in installing bonded resistance strain gages can have significant effects upon the performance of those sensors. Optimum and reproducible detection of surface deformation requires appropriate and consistent strain gage and bonding technique selection, surface preparation, procedures for gage installation and adhesive use, lead wire connection, validation of operation, and protective coating application.