Surface chemical analysis. X-ray photoelectron spectroscopy. Measurement of silicon oxide thickness
表面化学分析 X射线光电子能谱 氧化硅厚度的测量
发布日期:
2018-11-05
BS ISO 14701:2018规定了几种测量(100)和(111)硅片表面氧化层厚度的方法,当使用X射线光电子能谱测量时,将其作为二氧化硅的等效厚度。它仅适用于平坦、抛光的样品,以及包含Al或Mg X射线源、允许定义光电子发射角的样品台和带有输入透镜的光谱仪(可限制为小于6°)的仪器?圆锥半角。对于厚度在1 nm到8 nm之间的热氧化物,使用本文件中描述的最佳方法,95%置信水平下的不确定度通常为2%左右,最佳情况下为1%左右。
给出了一种更简单的方法,其不确定性稍差,但通常足够。交叉引用:ISO 18115-1ISO 18116GUM:1995ISO/TR 18392ISO/IEC指南98-3:2008购买本文件时可获得的所有当前修订版均包含在购买本文件中。
BS ISO 14701:2018 specifies several methods for measuring the oxide thickness at the surfaces of (100) and (111) silicon wafers as an equivalent thickness of silicon dioxide when measured using X-ray photoelectron spectroscopy. It is only applicable to flat, polished samples and for instruments that incorporate an Al or Mg X-ray source, a sample stage that permits defined photoelectron emission angles and a spectrometer with an input lens that can be restricted to less than a 6? cone semi-angle. For thermal oxides in the range 1 nm to 8 nm thickness, using the best method described in this document, uncertainties, at a 95 % confidence level, could typically be around 2 % and around 1 % at optimum. A simpler method is also given with slightly poorer, but often adequate, uncertainties.Cross References:ISO 18115-1ISO 18116GUM:1995ISO/TR 18392ISO/IEC Guide 98-3:2008All current amendments available at time of purchase are included with the purchase of this document.