Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
半导体器件的机械标准化.第6-16部分:BGA LGA FBGA和FLGA用半导体试验和老化插座术语表（IEC 60191-6-16-2007）；德文版EN 60191-6-16:2007

2007-11-01

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸（IEC 60191-6-10-2003）；德文版EN 60191-6-10:2003

2004-05-01

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
半导体器件的机械标准化.第6-6部分:表面安装半导体器件封装外形图绘制的一般规则；细间距地栅阵列（FLGA）的设计指南（IEC 60191-6-6-2001）；德文版本EN 60191-6-6:2001

2002-02-01

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
半导体器件的机械标准化.第6-19部分:高温下封装翘曲和最大允许翘曲的测量方法（IEC 60191-6-19-2010）；德文版EN 60191-6-19:2010

2010-10-01

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
半导体器件的机械标准化.第1部分:分立器件外形图绘制的一般规则（IEC 60191-1-2018）；德国版本EN IEC 60191-1:2018

2018-10-01

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
半导体器件的机械标准化.第6-1部分:表面安装半导体器件封装外形图绘制的一般规则；鸥翼引线端子设计指南（IEC 60191-6-1-2001）；德文版EN 60191-6-1:2001

2002-08-01

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
半导体器件的机械标准化第6-17部分:表面安装半导体器件封装外形图绘制的一般规则堆叠封装的设计指南细间距球栅阵列和细间距地栅阵列（P-PFBGA和P-PFLGA）（IEC 60191-6-1）

2011-09-01

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法（IEC 60191-6-4-2003）；德文版EN 60191-6-4:2003

2004-01-01

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
半导体器件的机械标准化.第6-3部分:表面安装半导体器件封装外形图绘制的一般规则；quat扁平包装（QFP）包装尺寸的测量方法（IEC 60191-6-3-2000）；德文版EN 60191-6-3:2000

2001-06-01

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 60191-6-21-2010）；德文版EN 60191-6-21:2010

2011-03-01

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
半导体器件的机械标准化.第6-5部分:表面安装半导体器件封装外形图绘制的一般规则；细间距球栅阵列（FBGA）的设计指南（IEC 60191-6-5-2001）；德文版EN 60191-6-5:2001

2002-05-01

BS EN 60191-6. Mechanical standardization of semiconductor devices. Part 6. General rules for the preparation of outline drawings of surface mounted semicondutor device packages
英国标准EN 60191-6 半导体器件的机械标准化 第六部分 表面安装半导体器件封装外形图绘制通则

2007-06-25

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则；玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南（IEC 60191-6-8-2001）；德文版EN 60191-6-8:2001

2002-05-01

IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
IEC 60191-1第2版 半导体器件的机械标准化 第一部分 分立器件外形图绘制通则

2005-02-09

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）封装尺寸的测量方法（IEC 60191-6-20-2010）；德文版EN 60191-6-2

2011-03-01

IEC 60191-2/F54/ED.1. Mechanical standardization of semiconductor devices. Part 2. Large power package with 39 pins
IEC 60191-2/F54/ED.1 半导体器件的机械标准化 第二部分 39针大功率封装

2005-02-14

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
半导体器件的机械标准化.第3部分:集成电路外形图绘制的一般规则（IEC 60191-3-1999）；德文版EN 60191-3:1999

2000-07-01

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1.50 mm, 1.27 mm and 1.00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
半导体器件的机械标准化.第6-2部分:表面安装半导体器件封装外形图绘制的一般规则；1.50 mm、1.27 mm和1.00 mm节距球型和柱型端子组件的设计指南（IEC 60191-6-2-2001）；德文版EN 60191-

2002-09-01

BS EN 60191-6-19. Mechanical standardization of semiconductor devices. Part 6-19. Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
英国标准EN 60191-6-19 半导体器件的机械标准化 第6-19部分 包装高温翘曲和最大允许翘曲的测量方法

2008-01-03

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
半导体器件的机械标准化.第6-16部分:BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

2007-04-26