IEC 60068-2-10:20 05+A1:2018提供了一种测试方法，用于确定电工产品支持霉菌生长的程度以及任何霉菌生长如何影响产品的性能和其他相关属性。由于霉菌生长条件包括高相对湿度，该测试适用于旨在在潮湿条件下运输、储存和使用至少几天的电工产品。与上一版相比的主要变化如下: -两种测试真菌被另外两种替代 -为每种测试真菌定义的孢子浓度 -另外引入矿物盐溶液中的孢子悬浮液 -通过规定的湿热储存对样品进行预处理 -孢子悬浮液的超声雾化作为引入的优选接种方法 -孵育持续时间从84天减少至56天 -霉菌生长程度2级分为2a级和2b级 -关于接种方法的详细信息见附件B -附件E:流程图已删除，根据IEC指南104，它具有水平标准的地位。该合并版本由第六版（2005年）及其修正案1（2018年）组成。因此，除本出版物外，无需下令修订。

IEC 60068-2-10:2005+A1:2018 provides a test method for determining the extent to which electrotechnical products support mould growth and how any mould growth may affect the performance and other relevant properties of the product. Since mould growth conditions include high relative humidity, the test is applicable to electrotechnical products intended for transportation, storage and use under humid conditions over a period of some days at least. The main changes with respect to the previous edition are listed below:
- Two test fungi replaced by two others
- Concentration of the spores defined for each test fungus
- Spores suspension in mineral salt solution additionally introduced
- Pre-conditioning of the specimens by damp heat storage prescribed
- Supersonic aerosolization of the spores suspension as the preferred inoculation method introduced
- Duration of incubation reduced from 84 days to 56 days
- Extent of mould growth grade 2 split into grade 2a and grade 2b
- Detailed information on methods of inoculation given in Annex B
- Annex E: flow-chart deleted It has the status of a horizontal standard in accordance with IEC Guide 104. This consolidated version consists of the sixth edition (2005) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.