IEC 61191-6:2010规定了热循环寿命范围内空隙的评估标准，以及使用X射线观察测量空隙的方法。IEC 61191的本部分适用于板上焊接的BGA和LGA焊点中产生的空隙。IEC 61191的这一部分在BGA封装组装到电路板上之前不适用于BGA封装本身。除BGA和LGA外，本标准还适用于具有熔融和再固化接头的设备，如倒装芯片设备和多芯片模块。本标准不适用于设备和电路板之间的填充不足的接头，或设备封装内的焊接接头。本标准适用于焊接接头中产生的尺寸为10μm至几百微米的大孔隙，但不适用于直径小于10μm的较小孔隙（通常为平面微孔）。 本标准用于评估目的，适用于研究、离线生产过程控制和装配可靠性评估。

IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 μm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 μm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.