1.1 本指南介绍了电解抛光作为金相试样制备方法。描述了各种金属的抛光程序。 注1: 工具书类 ( 1- 133 ) 2. 电解抛光将为读者提供超出本指南范围的具体信息。 1.2 以国际单位制表示的数值应视为标准值。本标准不包括其他计量单位。 1.3 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任在使用前制定适当的安全、健康和环境实践，并确定监管限制的适用性。 具体安全预防措施见第节 5. 和 6.3.1 . 1.4 本国际标准是根据世界贸易组织技术性贸易壁垒（TBT）委员会发布的《关于制定国际标准、指南和建议的原则的决定》中确立的国际公认标准化原则制定的。 ====意义和用途====== 4.1 电解抛光的优点: 4.1.1 对于某些金属，可以生产出与机械方法相同或更好的高质量表面光洁度。 4.1.2 一旦建立了程序，可以快速获得满意的结果，并具有再现性。 4.1.3 如果按顺序抛光相同材料的多个试样，可以显著节省时间。 4.1.4 在相对较大的金属零件表面上对选定区域进行电解抛光可以无破坏性地完成，也就是说，无需切割以移除工件。 4.1.5 可能难以通过机械方法抛光的软单相金属可以成功地进行电抛光。 4.1.6 可以获得试样的真实微观结构，因为即使通过仔细研磨和机械抛光操作，表面上产生的伪影（如扰动金属、划痕和机械孪晶）也可以去除。 这些特性在低负荷硬度测试、X射线衍射研究和电子显微镜中非常重要，在电子显微镜中，更高的分辨率会优先考虑未变形的金属表面。 4.1.7 电抛光完成后，通常可以通过在关闭前短时间降低电压（通常为抛光所需的十分之一左右）来完成蚀刻。 注2: 并非所有的电解抛光溶液都能产生良好的蚀刻效果。 4.2 电解抛光的缺点: 4.2.1 如果处理不当，电解抛光中使用的许多化学混合物是有毒或危险的（参见第节） 5. ). 这些危害与蚀刻剂混合和处理中涉及的危害相似，见测试方法 E407年 . 4.2.2 在多相合金中，每个相的抛光速率可能不同。结果可能是非平面表面。 4.2.3 电抛光表面可能略微起伏，而不是完全平面，因此可能不适合在所有放大倍数下进行检查。 4.2.4 与各种不均匀性（如非金属夹杂物和孔洞）相邻的区域的抛光速率通常大于周围基体中的抛光速率，并且往往会夸大夹杂物和孔洞的大小。 4.2.5 凹痕、凹坑和波纹度限制了涉及表面现象、涂层、界面和裂纹的应用。边缘往往优先受到攻击，导致边缘圆角。 4.2.6 工件可以通过电解抛光产生。 4.2.7 试样安装材料可能与电解液发生反应。 4.2.8 某些材料的电抛光表面可能是被动的，难以蚀刻。 4.2.9 通过电解抛光的金属去除率通常很低，通常约为1μm/min，如果在600粒度碳化硅研磨后停止制备，并且电解抛光时间短，则可能无法去除所有先前由切割和研磨引起的损伤。 4.2.10 可能需要大量电解质来抛光给定实验室遇到的各种金属。开发新合金的程序可能需要相当长的时间。

1.1 This guide deals with electrolytic polishing as a means of preparation of specimens for metallographic purposes. Procedures are described for polishing a variety of metals. Note 1: References ( 1- 133 ) 2 on electrolytic polishing will provide the reader with specific information beyond the scope of this guide. 1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. Specific safety precautions are described in Section 5 and 6.3.1 . 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. ====== Significance And Use ====== 4.1 Advantages of Electrolytic Polishing: 4.1.1 For some metals, a high quality surface finish can be produced that is equivalent to, or better than, that which can be obtained by mechanical methods. 4.1.2 Once procedures have been established, satisfactory results can be obtained rapidly with reproducibility. 4.1.3 There can be a marked saving of time if many specimens of the same material are polished sequentially. 4.1.4 Electropolishing a selected area on the surface of a relatively large metal part can be accomplished nondestructively, that is, without the need for sectioning to remove a piece. 4.1.5 Soft, single-phase metals, which may be difficult to polish by mechanical methods, may be successfully electropolished. 4.1.6 The true microstructure of a specimen can be obtained because artifacts (such as disturbed metal, scratches, and mechanical twins) produced on the surface, even by careful grinding and mechanical polishing operations, can be removed. These features are important in low-load hardness testing, X-ray diffraction studies, and in electron microscopy, where higher resolution puts a premium on undistorted metal surfaces. 4.1.7 After electropolishing is completed, etching can often be accomplished by reducing the voltage (generally to about one-tenth that required for polishing) for a short time before it is turned off. Note 2: Not all electropolishing solutions produce good etching results. 4.2 Disadvantages of Electrolytic Polishing: 4.2.1 Many of the chemical mixtures used in electropolishing are poisonous or dangerous if not properly handled (see Section 5 ). These hazards are similar to those involved in the mixing and handling of etchants, see Test Methods E407 . 4.2.2 In multi-phase alloys, the polishing rate of each phase may be different. The result may be a non-planar surface. 4.2.3 Electropolished surfaces may be slightly undulated rather than perfectly planar and, therefore, may not be suitable for examination at all magnifications. 4.2.4 The rate of polishing in areas adjacent to various inhomogeneities, such as nonmetallic inclusions and voids, is usually greater than that in the surrounding matrix and tends to exaggerate the size of the inclusions and voids. 4.2.5 Dimples, pits, and waviness limit applications involving surface phenomena, coatings, interfaces, and cracks. Edges tend to be attacked preferentially, resulting in edge rounding. 4.2.6 Artifacts may be produced by electropolishing. 4.2.7 Specimen mounting materials may react with the electrolyte. 4.2.8 The electropolished surfaces of certain materials may be passive and difficult to etch. 4.2.9 Metal removal rates by electropolishing are usually quite low, typically about 1 μm/min, and all of the prior induced damage from cutting and grinding may not be removed if preparation is stopped after a 600-grit SiC grind and electropolishing times are short. 4.2.10 A large number of electrolytes may be needed to polish the variety of metals encountered by a given laboratory. Considerable time may be required to develop a procedure for a new alloy.