1.1 本规范涵盖用于非电子应用的焊料金属合金（通常称为软钎料），包括但不限于锡铅、锡锑、锡锑铜银、锡锑铜银镍、锡银、锡铜银和铅锡银，用于在低于熔点的温度下将两种或两种以上金属连接在一起。本规范不包括电子焊接应用的电子级焊料合金以及助焊剂和非助焊剂固体焊料，因为它们是由IPC–连接电子工业协会赞助的。 1.1.1 这些焊料包括液相线温度不超过800°F（430°C）的合金。 1.1.2 本规范包括固体棒、锭、粉末和特殊形式的焊料，以及固体和焊剂芯带、焊丝和焊膏形式的焊料。 1.2 以英寸-磅为单位的数值应视为标准值。括号中给出的值是到国际单位制的数学转换，仅供参考，不被视为标准值。 1.3 本标准并非旨在解决与其使用相关的所有安全问题（如有）。 本标准的用户有责任熟悉所有危险，包括制造商提供的本产品/材料的适当安全数据表（SDS）中确定的危险，建立适当的安全、健康和环境实践，并在使用前确定监管限制的适用性。 1.4 本国际标准是根据世界贸易组织技术性贸易壁垒（TBT）委员会发布的《关于制定国际标准、指南和建议的原则的决定》中确立的国际公认标准化原则制定的。

1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries. 1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C). 1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste. 1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Safety Data Sheet (SDS) for this product/material as provided by the manufacturer, to establish appropriate safety, health, and environmental practices, and determine the applicability of regulatory limitations prior to use. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.