BS EN 61249-5-4:1997-互连结构材料带涂层和不带涂层的导电箔和膜的分规范集导电油墨-国家数字标准馆

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Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings-Conductive inks 互连结构材料带涂层和不带涂层的导电箔和膜的分规范集导电油墨

发布日期： 1997-05-15

导电油墨和用于替代触点金属饰面的导电油墨的鉴定要求。还提供了关于具有导电油墨的印制板适用性的指南。交叉引用:IEC 1189-2IEC 1189-3BS 2011:第2.1部分ABS 2011:第2.1部分BS EN 60068-2-2

Requirements for the qualification of conductive inks and for conductive inks intended for use as a substitute for metallic finishes on contacts. Also provides guidance on the suitability of printed boards which feature conductive inks.Cross References:IEC 1189-2IEC 1189-3BS 2011:Part 2.1CaBS 2011:Part 2.1TBS EN 60068-2-2

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发布单位或类别：英国-英国标准学会

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BS EN 61249-7-1-1996

Materials for interconnection structures. Sectional specification set for restraining core materials-Copper/invar/copper
互连结构材料约束型芯材料的分规范集铜/因瓦/铜

IEC 61249-7-1-1995

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
互连结构材料 - 第7部分:限制核心材料的部分规范 - 第1节:铜/殷钢/铜

UNE-EN 61249-7-1-1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER.
互连结构材料第7部分:约束芯材的分规范集第1节:铜/因瓦/铜

BS EN 61249-8-7-1997

Materials for interconnection structures. Sectional specification set for non-conductive films and coatings-Marking legend inks
互连结构材料非导电薄膜和涂层分规范集标记图例墨水

BS EN 61249-8-8-1997

Materials for interconnection structures. Sectional specification set for non-conductive films and coatings-Temporary polymer coatings
互连结构材料非导电薄膜和涂层分规范集临时聚合物涂层

UNE-EN 61249-5-4-1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS. SECTION 4: CONDUCTIVE INKS.
互连结构材料第5部分:带或不带涂层的导电箔和薄膜分规范集第4节:导电油墨

IEC 61249-8-7-1996

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
互连结构材料 - 第8部分:非导电膜和涂层的部分规范 - 第7节:标记图例油墨

IEC 61249-8-8-1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
互连结构材料 - 第8部分:非导电膜和涂层的分段规范 - 第8节:临时聚合物涂层

IEC 61249-5-4-1996

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
互连结构材料第5部分:带或不带涂层的导电箔和薄膜的分规范 - 第4节:导电油墨

UNE-EN 61249-8-8-2000

Materials for interconnection structures -- Part 8: Sectional specification set for non-conductive films and coatings -- Section 8: Temporary polymer coatings.
互连结构材料第8部分:非导电薄膜和涂层分规范第8节:临时聚合物涂层

UNE-EN 61249-8-7-1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
互连结构材料第8部分:非导电薄膜和涂层分规范集第7节:标记图例墨水

BS EN 61249-5-1-1996

Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings-Copper foils (for the manufacture of copper-clad base materials)
互连结构材料带涂层和不带涂层的导电箔和膜的分规范集铜箔（用于制造覆铜基材）

IEC 61249-5-1-1995

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
互连结构材料 - 第5部分:带和不含涂层的导电箔和薄膜的剖面规格 - 第1节:铜箔（用于制造铜包基材料）

BS EN 61249-2-12-1999

Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad-Epoxide non-woven aramid laminate of defined flammability, copper-clad
互连结构材料包覆和未包覆增强基材分规范集规定可燃性的覆铜环氧无纺布芳纶层压板规定可燃性的覆铜环氧无纺布芳纶层压板

BS EN 61249-3-3-1999

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
互连结构材料包覆和未包覆的非增强基材分规范集（适用于柔性印制板）涂有粘合剂的柔性聚酯薄膜涂胶柔性聚酯薄膜

BS EN 61249-3-5-1999

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Transfer adhesive films for flexible printed boards
互连结构材料覆层和非覆层非增强基材分规范集（适用于柔性印制板）

BS EN 61249-2-13-1999

Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad-Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
互连结构材料包覆和非包覆增强基材分规范集

IEC 61249-6-3-2023

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
印制板和其他互连结构用材料.第6-3部分:增强材料分规范集.印制板用“E”玻璃编织成品织物规范

BS EN 61249-4-1-2008

Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
印制板和其他互连结构用材料

IEC 61249-4-2-2005

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
印刷电路板及其他互连结构材料 - 第4-2部分:预浸材料的分段规格书未包装 - 多功能环氧化物编织的易燃玻璃预浸料

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