IPC 6018D-高频（微波）印制板的鉴定和性能规范-国家数字标准馆

现行 IPC 6018D

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Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 高频（微波）印制板的鉴定和性能规范

发布日期： 2022-02-01

本规范涵盖了用于微带、带状线、混合介质和多层带状线应用的高频（微波）印制板的最终产品检验和测试，包括或不包括埋置/盲孔和金属芯。印制板可包含嵌入式有源或无源电路，带有符合IPC-6017的分布电容平面、电容或电阻元件。印制板可能包含堆积的高密度互连（HDI）层。

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.

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发布单位或类别：美国-美国电子电路和电子互连行业协会

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