现行

SJ/T 11534-2015

微波电路用覆铜箔聚四氟乙烯玻纤布层压板
Copper-clad PTFE woven glass fabric laminate for microwave circuit

2015-04-30

现行

SJ 52142/2-2003

覆铜箔聚苯醚玻纤布层压板详细规范
Detail Specification for Polyphenylene Oxide Woven Glass fibre Copper Clad Laminate

2003-06-04

现行

BS EN 60249-2-4-1994

Specifications-Specification for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade-Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade
规格

2001-04-15

现行

BS EN 60249-2-10-1994

Specifications-Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-06-01

现行

BS EN 60249-2-16-1993

Specifications-Specification No. 16. Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-06-15

现行

SJ 20224-1992

印制线路板用阻燃型覆铜箔环氧玻璃布层压板详细规范
Detail specification for epoxide woven glass fabric copper-clad laminated sheets of flammability resistance for printed wiring boards

1992-11-19

现行

BS 4584-13-1977

Specification for metal-clad base materials for printed circuits-Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13
印制电路用金属覆层基材规范 硅机织玻璃纤维覆铜层压板Si-GC-Cu-13

1977-11-30

现行

BS EN 60249-2-18-1993

Specifications-Specification No. 18. Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-06-15

现行

BS EN 60249-2-17-1993

Specifications-Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

BS EN 60249-2-11-1994

Specifications-Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

UNE-EN 60249-2-4/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

UNE-EN 60249-2-4-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

UNE-EN 60249-2-10-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILIY (VERTICAL BURNING TEST).
印刷电路的基材 第2部分:规范 规范10:规定易燃性的环氧无纺/玻璃纤维编织增强覆铜层压板（垂直燃烧试验）

1996-07-24

现行

UNE-EN 60249-2-4/A4-1996

BASE MATERIAL FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

BS EN 61249-2-7-2002

Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad-Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
互连结构材料 包覆和未包覆增强基材分规范集 规定可燃性（垂直燃烧试验）覆铜环氧编织E玻璃层压板

2006-08-31

现行

MIL MIL-P-13949/14A Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃 微波应用 覆铜（取代MIL-P-13949/14）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/14A Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃 微波应用 覆铜（取代MIL-P-13949/14）（无S/S文件）

1997-08-01

现行

MIL MIL-P-13949/14A Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
塑料板 层压板 金属层（印刷线路板） 基材GY 玻璃基板 聚四氟乙烯树脂 耐火材料 用于微波应用 铜箔（取代MIL-P-13949/14）（NO S/S文件）

1987-02-11

现行

MIL MIL-P-13949/14A

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板（用于印制线路板） 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃（取代MIL-P-13949/14）（无S/S文件）

1987-02-11

现行

BS EN 60249-2-19-1993

Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格 第19号规范 用于制造多层印制板的规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1992-09-15