本规范规定了用于微电路、敏感半导体器件、敏感电阻器和相关高级组件军事包装的热密封、静电放电保护、柔性屏障材料的要求。此外，I类材料提供防水防蒸汽保护和电磁干扰效应衰减（见6.1）。

This specification establishes the requirements for heat-sealable, electrostatic discharge protective, flexible barrier materials used for the military packaging of microcircuits, sensitive semiconductor devices, sensitive resistors, and associated higher assemblies. In addition, the type I materials provide for watervaporproof protection and attenuation of electromagnetic interference effects (see 6.1).