提供了一种测试方法，用于确定电工产品支持霉菌生长的程度，以及霉菌生长如何影响产品的性能和其他相关特性。 由于霉菌生长条件包括较高的相对湿度，本试验适用于打算在潮湿条件下运输、储存和使用至少几天的电工产品。 与上一版相比，主要变化如下: -两种测试真菌被另外两种真菌取代 -为每种测试真菌定义的孢子浓度 -另外还引入了矿物盐溶液中的孢子悬浮液 -通过规定的湿热储存对试样进行预处理 -介绍了孢子悬浮液的超声雾化作为首选接种方法 -孵化时间从84天缩短到56天 -2级霉菌生长程度分为2a级和2b级 -关于接种方法的详细信息见附件B -附件E:删除流程图 具有符合IEC指南104的基本安全出版物的状态。

Provides a test method for determining the extent to which electrotechnical products support mould growth and how any mould growth may affect the performance and other relevant properties of the product. Since mould growth conditions include high relative humidity, the test is applicable to electrotechnical products intended for transportation, storage and use under humid conditions over a period of some days at least. The main changes with respect to the previous edition are listed below: - Two test fungi replaced by two others - Concentration of the spores defined for each test fungus - Spores suspension in mineral salt solution additionally introduced - Pre-conditioning of the specimens by damp heat storage prescribed - Supersonic aerosolization of the spores suspension as the preferred inoculation method introduced - Duration of incubation reduced from 84 days to 56 days - Extent of mould growth grade 2 split into grade 2a and grade 2b - Detailed information on methods of inoculation given in Annex B - Annex E: flow-chart deleted Has the status of a basic safety publication in accordance with IEC Guide 104.